China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
4
Home > Products >

practical thermally conductive encapsulant

Browse Categories

Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
View Contact Details
261 - 270 of 336

practical thermally conductive encapsulant

Selling leads
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:32
8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32
8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:32
Pink 8.0W/m.K Thermal Conductivity 55 Shore OO Hardness Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + ... 2024-12-09 17:19:32
8 W/m.K Thermal Conductivity 55 Shore Oo Hardness Silicone Soft Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32
Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
8.0W/m.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV​ Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
Page 27 of 34 :   |< << 23 24 25 26 27 28 29 30 31 >> >|