Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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practical thermal conductive gap filler

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Tear Resistant Soft Thermal Pads

Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32

Tear Resistant Soft Thermal Pads

Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 22:03:00

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 22:03:00

RoHS Silicone Thermal Pad For PC , Multiscene Electrically Conductive Thermal Pad

Ultra Soft Thermal Pad Ultra soft and highly compliant with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

RoHS Silicone Thermal Pad For PC , Multiscene Electrically Conductive Thermal Pad

Ultra Soft Thermal Pad Ultra soft and highly compliant with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2026-04-06 00:29:56

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2026-04-06 00:29:56

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56

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