China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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networking thermal conductive pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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networking thermal conductive pad

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Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:32
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25
Ultra Soft Thermal Pad low permeability oil gap filler with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 22:03:00
Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
...Thermal Pad Material For Led Lighting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 ... 2024-12-09 17:19:32
...Thermal Pad Material For Led Lighting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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