121 - 130 of 390
networking thermal conductive pad
Selling leads
|
high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 17:19:13
|
|
|
high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone Attribute Value Test Method Composition Ceramic filler + ...
2024-12-09 22:03:00
|
|
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ...
2024-12-09 17:19:13
|
|
|
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ...
2025-01-02 00:10:25
|
|
...) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivi...
2024-12-09 17:19:32
|
|
|
...) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivi...
2024-12-09 22:03:00
|
|
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler ...
2024-12-09 17:19:13
|
|
|
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler ...
2024-12-09 22:03:00
|
|
30 ShoreOO Hardness 1.0W/m.K Ultra Soft Thermal Silicone Pad For 5G Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ...
2024-12-09 17:19:32
|
|
|
30 ShoreOO Hardness 1.0W/m.K Ultra Soft Thermal Silicone Pad For 5G Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ...
2025-01-02 00:10:25
|