Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking

Product feature

1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size

Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.