3 W/m.K Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

3W/m.K Thermal Conductivity Silicone Liquid Gap Filler Usage Temperature -40 ℃ ~ 150 ℃

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5 W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

Two-part dispensable gap filler

TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40 ℃ ~ 200 ℃.

Purchase information
Packing specification: 50 ml (25 ml each part) / 400 ml(200 ml each part)/20 kg (10 kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.