Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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multiscene thermal insulation pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multiscene thermal insulation pad

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Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56

Heatproof Thermally Conductive Encapsulant Silicone Sealant Multiscene Practical

Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

Heatproof Thermally Conductive Encapsulant Silicone Sealant Multiscene Practical

Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler ... 2026-04-06 00:29:56

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32

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