China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multiscene silicone heat sink compound

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multiscene silicone heat sink compound

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Silicone Grease Heat Sink Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 17:19:13
Silicone Grease Heat Sink Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 22:03:00
1W/m.K White Silicone Heat Sink Thermal Grease For CPU & GPU Support To OEM&ODM Attribute Value Test Method Composition Non-Vulcanized Silicone Oil ... 2024-12-09 17:19:13
Grey Thermal Cooling Silicone Heat Sink Thermal Grease For Laptop CPU Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 17:19:13
1W/m.K White Silicone Heat Sink Thermal Grease For CPU & GPU Support To OEM&ODM Attribute Value Test Method Composition Non-Vulcanized Silicone Oil ... 2024-12-09 22:03:00
Grey Thermal Cooling Silicone Heat Sink Thermal Grease For Laptop CPU Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 22:03:00
Heat Sink Thermal Grease 1.0W/m.K Thermal Conductivity Slicone Base Grey Paste For LED Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 17:19:13
Heat Sink Thermal Grease 1.0W/m.K Thermal Conductivity Slicone Base Grey Paste For LED Attribute Value Test Method Composition Non-Vulcanized Silicone ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
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