Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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multiscene high conductivity thermal pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multiscene high conductivity thermal pad

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RoHS Thickness 0.5mm Thermal Pads PCB, Nontoxic Electrically Conductive Thermal Pad

0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:32

RoHS Thickness 0.5mm Thermal Pads PCB, Nontoxic Electrically Conductive Thermal Pad

0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56

AOK Tasteless Heat Sink Silicone Pad, Heatproof Electrically Conductive Thermal Pad

0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32

AOK Tasteless Heat Sink Silicone Pad, Heatproof Electrically Conductive Thermal Pad

0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ... 2026-04-06 00:29:56

RoHS Multiscene Gap Filler Pad , Acrylate Thermal Pad For Electronics

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

RoHS Multiscene Gap Filler Pad , Acrylate Thermal Pad For Electronics

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2026-04-06 00:29:56

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2026-04-06 00:29:56

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