China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multiscene gpu heat pads

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multiscene gpu heat pads

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Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25
Chinese Supplier White Silicone Sealant Adhesive Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 17:19:13
Chinese Supplier White Silicone Sealant Adhesive Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ... 2024-12-09 22:03:00
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler ... 2024-12-09 17:19:13
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Attribute Value Test Method Composition Ceramic filler ... 2024-12-09 22:03:00
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
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