Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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heatproof thermal pad electronics

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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56

UL Certification Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:13

UL Certification Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

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