Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

171 - 180 of 280

heatproof thermal pad electronics

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Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2026-04-06 00:29:56

Weather Resistant Thermal Sheet CPU

...Thermal Pad Material For Led Lighting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 ... 2024-12-09 22:03:00

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Automotive Thermal Conductive Pad Ultrasoft Durable For Heat Sink

TP120 Thermal Conductive Pad custom thickness thermal pads SSD thermal conductive silicone pad Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

Automotive Thermal Conductive Pad Ultrasoft Durable For Heat Sink

TP120 Thermal Conductive Pad custom thickness thermal pads SSD thermal conductive silicone pad Attribute Value Test Method Composition Ceramic Filler ... 2026-04-06 00:29:56

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2024-12-09 17:19:13

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2026-04-06 00:29:56

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