Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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heatproof thermal gap filler material

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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:32

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2026-04-06 00:29:56

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

...Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual ... 2024-12-09 17:19:32

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

...Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual ... 2026-04-06 00:29:56

RoHS Reusable Thermal Pad Material Silicone 8 W/m.K For Network Switch

8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

RoHS Reusable Thermal Pad Material Silicone 8 W/m.K For Network Switch

8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 22:03:00

Thickness 0.5 mm Thermal Pad Material Silicone 8 W/m.K Blue Color

Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

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