Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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electronics thermal silicone pad

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Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

...Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

UL Certification Heatproof Thermally Conductive Potting Compound For Electronics

...Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Notebook Thermal Pad

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:32

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

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