Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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ddr thermal pad

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2.5g/cc CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

Ultra Soft thermal pad 1.5 mm thickness silicone rubber adhesive cooling laptop thermal pad Attribute Value Test Method Composition Ceramic Filler, ... 2025-01-02 00:10:25

Multiscene Laptop CPU Thermal Pad

Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 22:03:00

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

Ultra soft series 1.0w/m.k thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Notebook Thermal Pad

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:32

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