Multiscene Laptop CPU Thermal Pad
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Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation
Product feature: ■ Thermal Conductivity:1.0 W/m.K
Typical applications:
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
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Product Tags: Laptop Thermal Pad CPU Thermal Pad Ultra Soft Thermal Pad |
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