Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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cpu thermal pad material

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Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads

0.5 mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone -- Color ... 2024-12-09 17:19:32

Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads

0.5 mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone -- Color ... 2026-04-06 00:29:56

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

...Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual ... 2024-12-09 17:19:32

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

...Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual ... 2026-04-06 00:29:56

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2026-04-06 00:29:56

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