Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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anti interfere thermal pad electronics

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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anti interfere thermal pad electronics

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RoHS 1.5 W/m.K Thermal Conductive Pad Anti Insulation For Notebooks

Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25

Anti Corrosion PCB Heat Sink Pad

Yellow Thickness High Breakdown Voltage Thermal Insulation Silicone Pad Attribute Value Test Method Product TC1500B - Composition Silicone + ... 2024-12-09 22:03:00

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

Odorless Thermal Tape For GPU , Anti Corrosion Silicone Heat Sink Pad

1.4 W/m.k Yellow Silicone Thermal Insulation Pad For Server Cooling With Long Shelf Life Attribute Value Test Method Product TC1500B - Composition ... 2024-12-09 17:19:32

Odorless Thermal Tape For GPU , Anti Corrosion Silicone Heat Sink Pad

1.4 W/m.k Yellow Silicone Thermal Insulation Pad For Server Cooling With Long Shelf Life Attribute Value Test Method Product TC1500B - Composition ... 2025-01-02 00:10:25

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2024-12-09 17:19:13

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2025-01-02 00:10:25

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

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