China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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anti interfere thermal pad electronics

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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anti interfere thermal pad electronics

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Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
Blue Ultra Soft Series 1.0W/m.K Thermal Silicone Pad For Computer Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2025-01-02 00:10:25
1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:13
1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25
0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2024-12-09 17:19:32
0.25 mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad Attribute Value Test Method Product TC1500B - ... 2025-01-02 00:10:25
Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13
Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2025-01-02 00:10:25
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
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