Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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anti insulation cpu thermal paste

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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

RoHS 1.5 W/m.K Thermal Conductive Pad Anti Insulation For Notebooks

Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13

RoHS 1.5 W/m.K Thermal Conductive Pad Anti Insulation For Notebooks

Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25

UL Conductive Heat Sink Thermal Grease Multiscene Anti Insulation

Heat Sink Thermal Grease Cooler Cooling Fan Silicone Plaster Heat Sink Compound High Performance Attribute Value Test Method Composition Non... 2024-12-09 17:19:13

UL Conductive Heat Sink Thermal Grease Multiscene Anti Insulation

Heat Sink Thermal Grease Cooler Cooling Fan Silicone Plaster Heat Sink Compound High Performance Attribute Value Test Method Composition Non... 2024-12-09 22:03:00

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 ... 2024-12-09 17:19:13

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 ... 2024-12-09 22:03:00

Purple Heatproof PCB Heat Sink Pad , Anti Insulation Thermal Interface Pad

Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

Heatproof Blue Silicone Thermal Pad Anti Insulation Tensile Strength 0.4 KN/M

Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:13

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