China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
View Contact Details
251 - 260 of 402 Selling leads
1.0W/m.K 0.5mm Thickness Ultra Soft Thermal Silicone Pad For Ev display Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Blue Ultra Soft Series 1.0W/m.K Thermal Silicone Pad For Computer Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
30 ShoreOO Hardness 1.0W/m.K Ultra Soft Thermal Silicone Pad For 5G Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32
1.0 W/m.K 30 Shore OO Hardness Ultra Soft Thermal Silicone Pad For Notebook Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
0.5mm Thickness Ultra Soft 1.0W/m.K Thermal conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13
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