Gold Finger Plating Buried Blind Hole PCB Board Design Thru-Hole
Assembly Prototype PCB Assembly Description: 1. Focus on high-speed and high-density PCB design.
2. Industry-leading SI/PI simulation.
3. Many years of experience. Prototype PCB Assembly Parameters: | Item | Technical Parameter | | Layer | 2-64 | | Thickness | 0.3-6.5mm | | Copper Thickness | 0.3-12 oz | | Min Mechanical Hole | 0.1mm | | Min Laser Hole | 0.075mm | | HDI | 1+n+1,2+n+2,3+n+3 | | Max Aspect Ratio | 20:01 | | Max Board Size | 650mm*1130mm | | Min Width/Space | 2.4/2.4mil | | Min Outline Tolerance | ±0.1mm | | Impedance Tolerance | ±5% | | Min PP Thickness | 0.06mm | | Bow &Twist | ≤0.5% | | Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 | | Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP | | Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Prototype PCB Assembly Introduction: 1. Testability
A relatively complete test method and test standard have been
established, and the qualification and service life of PCB products
can be detected and identified through various test equipment and
instruments.
2. Assemblability
PCB products not only facilitate the standardized assembly of
various components but also enable automated and large-scale mass
production. In addition, the overall assembly of the PCB and
various other components can also form larger components, systems,
and even complete machines.
3. Maintainability
Since the components of PCB products and various components are
assembled in a standardized design and large-scale production,
these components are also standardized. Therefore, once the system
fails, it can be replaced quickly, conveniently and flexibly, and
the work of the system can be quickly restored.
|
