Online High Speed 3D SPI SMT Machine SMD Solder Paste Inspection Equipment A630
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TECHNICAL PARAMETERS: Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP) Inspection type:Volume, area, height, XY offset, shape, etc. Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc. Smallest component size: 01005. Accuracy: XY=10 um,Height = 0.37 um. Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma). Maximum Loading PCB Size(X*Y): 630x686mm. Inspection Speed: 0.42 SEC/FOV. Fiducial Detection Time: 0.3sec/piece. Maximum detection height:±450um(±1200umOption). RGB Tune patented technology. D-lighting patented technology. Barcode function with traceability. Badmark transfer function to mounters. Access IMS system functions. Operating System Support: Windows 10 Professional (64 bit). Five-minute programming, one-click operation. SPC process control.
Core Technology and Features
1.PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY Phase modulation profiling technology (PMP) is used to achieve three-dimensional measurement of printed solder paste, which can greatly improve measurement accuracy while ensuring high-speed inspection.
2.ACTIVE RGB 2D LIGHT SOURCE,2D LIGHTING SOURCESPatented RGB Tune function takes Red, Green and Blue images and with unique filter algorism, to solve solder bridge detection false alarm and relative zero surface uncertain issue. In the mean time, provide the 2D/3D measurements and image of printed solder paste. ooperate with 2D lighting sources avoids problems caused by the angle of the red RGB color distortion effect in solder; RGB tuning in Different PCB colors is more versatile ; Fulfill a variety of dispensing process testing ; greatly improve the equipment ( height ,volume , area ) epeatability accuracy.
3.HIGH RESOLUTION AND HIGH FRAME RATE IMAGE PROCESSING UNITIt provides a variety of detection accuracy of 2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the customer’s requirements for product diversity and detection speed.
4.Z-AXIS DYNAMIC COMPENSATION + TELECENTRIC LENS STATIC COMPENSATIONSolves the problem of ordinary lens, squint and deformation by using high-cost telecentric lens and special software test algorithm, which greatly enhances the inspection accuracy and inspection ability. Achieves the industry's leading static compensation for FPC warping.
5.MINUTES PROGRAMMING AND ONE PRESS OPERATION Engineers with any levels of experience can independently program the system quickly and accurately through Gerber importing software module and the friendly programming interface. One-button operation by the operator is designed also greatly reduces the requirements for training.
6.POWERFUL PROCESS ANALYSIS (SPC)Real-time SPC information display,provides powerful quality control to the users. Complete variety of SPC tools, are aviable for users at a glance. |
Product Tags: SMD Solder Paste Inspection Equipment High Speed SPI SMT Machine 3D SPI SMT Machine |