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chip aoi wafer inspection
Selling leads
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Product Description: Device model S2020 Detection capacity Detection items Wire bonding inspection Detection type Ball size, solder offset, solder ...
2026-10-23 00:42:53
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Product Description: Our machine utilizes LED lighting, providing bright and even illumination for precise inspection. With Ethernet and USB ...
2026-10-23 00:42:53
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Product Description: 3D Solder Paste Inspection Device model K3205 Detection capacity Detection items Miss print, over solder, insufficient solder, ...
2026-10-23 00:42:53
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Application scope Solder joint and mounted device inspection Features 1.High speed, single FOV processing time is about 350ms 2.Anti-interference, ...
2026-10-23 00:42:53
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Product Description: One of the key features of this SMT machine is its 6.5 Mpix high-speed color camera, which is capable of capturing images at a ...
2026-10-23 00:42:53
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Testing Program Gold Wire lnspection: Gold Ball Size, Solder Joint Offset,Eccentric Ball GolfSolder Joint Non-Stick, Solder Joint Bridging, Missing ...
2026-10-23 00:42:53
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2026-10-23 00:42:53
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ModelRD30 Fully Automatic Rework RD30LBasic FunctionFunctionDefective die removing, residues cleaning, solder paste/adhesive printing, die bonding, ...
2026-10-23 00:42:53
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