AOI Tester for Gold wire testing, chip testing, sensor testing, dual gauge design approach

Testing Program

Gold Wire lnspection:

Gold Ball Size, Solder Joint Offset,Eccentric Ball GolfSolder Joint Non-Stick, Solder Joint Bridging, Missing BallPlanting, Solder Joint Adhesion, Solder Joint Foreign Objects,Loss ofAluminum, Overlapping Solder Joints, Damaged Protective Coating,BrokenSolder Joints, Loss of Gold in Gold Fingers, Large Flat Balls,Unsoldered←

Wires, soldering wrong wires, missing soldering wires, broken wires,

wires stepping, wires bridging, gold wires remaining, soldering wires

interlacing, dumping wires;

Chip Inspection

Wafer Chip Inspection

Wafer Chip Inspection

Semiconductor package testing equipment

Dual-track design method (vision & marking are both dual-track single head)

Ultra-high precision whole-plate image technology

based on whole-plate seamless splicing technology realizes high-precision quantitative value metrology such as offset and angle covariance.

μ-level metrology control capability

closed-loop control system to ensure positional accuracy <1um.

Electronic IO control

long service life, stable and noiseless; LED light status indication.

Vision Systems

Industrial Camera

High-speed multi-frame industrial digital cameras are used.

Telecentric Optical System

High depth of field, low distortion, full pixel, fixed resolution design.

Constant Current Light Source Controller

Full closed-loop constant current digital controller to ensure the stability and uniformity of light source brightness.

Process control SPC

1. Statistics of CPK, average value, extreme deviation, standard deviation, large value, small value of the product.

2. Customizable control chart of the loss of control rules, and alarm prompts.

3. Record the cause of the out-of-control point and processing measures, saved in the database.

Technical Parameters