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ball grid array assembly
Selling leads
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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... EMS solution for our customers: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) ...
2026-06-19 00:12:33
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...board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire ...
2026-06-19 00:12:33
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...our customers: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array ...
2026-06-19 00:12:33
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... Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Our company provide: -PCB/FPC fabrication ...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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