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ball grid array assembly
Selling leads
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...our customers: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array ...
2026-06-19 00:12:33
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...assemblies (SMT/THT),Components procurement. 2. Cable assembly and Wire harness.Box-building.Funtional Test. 3. High mix/ low volume and mid volume ...
2024-12-09 23:47:09
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..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips ...
2026-06-19 00:12:33
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..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips ...
2026-06-19 00:12:33
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... (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final assembly ※ Lead-Free,RoHS,Reach ...
2026-06-19 00:12:33
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...Assembly Service with OSP Surface Treatment RoHS Compliant Immersion Gold Process SMT Parameters: Technology Circuit PCB/Flex/Metal PCB/Rigid-Flex ...
2026-06-19 00:12:33
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... Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function ...
2026-06-19 00:12:33
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