This low CTE (low coefficient of thermal expansion) polyimide (PI)
film is a professional base material specially developed for
flexible printed circuit board (FPCB) manufacturing. Focusing on
core mass production demands of FPC industry, the product delivers
reliable dimensional stability and excellent flexible process
adaptability. It is widely applied in the production of flexible
circuits for consumer electronics, smart wearable devices,
automotive electronics and other fields.
The core advantage of the film lies in its ultra-stable low thermal
expansion property. It effectively solves common defects of
conventional PI films during high-temperature FPCB processes, such
as thermal expansion & contraction, warpage and dimensional
deviation. With thermally controllable shrinkage and expansion, the
film well matches the thermal expansion ratio of copper foil during
lamination, pressing, curing and reflow soldering. It significantly
reduces bad phenomena including board delamination, wrinkling and
circuit offset, improves finished product yield and positioning
accuracy, and fully meets the manufacturing requirements of
high-precision fine-line FPCs.
Manufactured with high-purity polyimide raw materials and optimized
film-forming technology, the product possesses balanced
comprehensive physical and chemical properties. It features
excellent mechanical toughness and outstanding bending resistance,
capable of withstanding long-term repeated bending and torsion
without cracking or deformation, perfectly adapting to the dynamic
working conditions of flexible electronic structures. In addition,
it offers superior electrical insulation, high temperature
resistance and aging resistance, maintaining stable physical
structure and electrical performance under long-term
high-temperature operation to ensure the safety and reliability of
FPC circuits.
This low CTE PI film features strong process compatibility and can
perfectly adapt to mainstream FPCB production procedures, including
copper cladding, adhesive lamination, laser cutting, precision
etching and surface treatment. No special parameter adjustment is
required, supporting stable and large-scale mass production.
Compared with ordinary standard PI films, it shows prominent
advantages in dimensional stability, process tolerance and
long-term reliability, serving as an ideal base material for
mid-to-high-end precision FPCs, ultra-thin flexible circuits and
high-frequency flexible circuit boards.
Positioned for practical industrial application, the product
focuses on core practical performance without redundant functional
premium. It balances process stability, finished product
reliability and mass production cost-effectiveness, fully
satisfying the manufacturing demands of commercial and
industrial-grade flexible printed circuits.
Our polyimide film is available in two types: yellow PI film and
black PI film, covering diversified FPC application scenarios with
standardized industrial thickness specifications:
Yellow PI Film
Available thickness ranges from 5μm to 100μm. Regular mainstream
specifications include 12.5μm, 25μm and 50μm. With stable basic
physical properties and reliable insulation performance, it is
suitable for most conventional FPC packaging and surface protection
applications.
Black PI Film
Mainstream standard specifications are 25μm and 50μm. While
retaining inherent high temperature resistance and flexibility of
polyimide material, it is equipped with excellent light-shielding
function, customized for high-precision optoelectronic FPC
scenarios.
PI film is mainly used for surface packaging and protective
insulation of flexible printed circuits (FPC), covering core
application scenarios in consumer electronics and optoelectronic
devices. The detailed functions are as follows:
- Circuit Protection: Covering the surface of FPC conductive circuits to isolate air
and moisture, effectively preventing circuit oxidation, corrosion
and mechanical damage. It stabilizes circuit performance and
extends the service life of flexible circuit boards.
- Electrical Insulation: Provides excellent dielectric insulation performance to prevent
short circuits and current leakage between adjacent circuits, ideal
for insulation isolation and packaging of high-density precision
FPC lines.
- Light Shielding (Black PI Film Exclusive): Applicable for scenarios requiring strict light shielding, such
as camera modules and display backlight modules. It effectively
blocks stray light interference, eliminates light leakage and
astigmatism, and guarantees stable imaging and display quality of
optoelectronic components.
- Flexible Bending Protection: Adaptable to long-term repeated bending and twisting. It is
widely used for flexible structural parts of terminal products,
including hinge areas of foldable phones and bending connection
positions of wearable devices, protecting FPC circuits from
fracture and failure during dynamic bending.
