Flexible Circuit & Semiconductor Encapsulation Grade PI Base Film
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Detailed Product Description
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Bespoke Polyimide Film Products for Flexible Circuits, Electrical
Motors, Power Cells and Aerospace Fields High-performance polyimide film for PCB, FPC and electronic
assembly applications with excellent thermal and electrical
properties.
Product Overview GL series high-performance polyimide film is a biaxially oriented
natural amber polyimide film, independently developed and
manufactured by our company. Available in three specifications with
distinct thicknesses and properties, primarily applied to adhesive
bases, chip packaging, and related industries. Key Features
Applications High-precision adhesive FCCL substrates, high-stability cover
films, chip packaging, and special adhesive tape substrates. Factory Advantages
Product Images Storage Instructions Store in a cool, dry place away from direct sunlight. Avoid
exposure to high humidity or extreme temperature fluctuations to
ensure longevity and performance. |
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| Product Tags: Flexible Circuit PI film Semiconductor encapsulation PI film Polyimide base film with warranty |
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