Cold Plate In Row Hyperscale Container Data Center 42U 50kW
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Deploying large-scale AI clusters—like NVIDIA HGX or DGX pods—demands cooling that’s both powerful enough for dense chips and simple enough to manage in hyperscale deployments. When you’re running dozens of high-performance GPUs across hyperscale infrastructure, scattered cooling loops create endless operational headaches: messy piping, hard-to-track maintenance, and inconsistent temperature control across racks—especially for systems requiring robust 50kW heat dissipation and 42U rack compatibility. Built specifically for hyperscale AI-ready environments, the Cold Plate In Row Hyperscale Container Data Center (42U, 50kW) solves this with a centralized in-row cold plate cooling architecture—all packed into a compact, transportable container. It streamlines facility management for hyperscale deployments while delivering pinpoint thermal control to 42U high-density AI racks, eliminating the complexity of distributed cooling components that slow down deployment and increase downtime risk, with 50kW total cooling capacity to match extreme heat loads. At its core is in-row cold plate liquid cooling that sends coolant directly to AI chip processors (Direct-to-Chip), pulling heat away from the most critical components efficiently to support the 50kW cooling demand. Integrated air handlers take care of residual heat, creating a seamless, turnkey hyperscale solution optimized for 42U racks that’s ready to support standardized AI training workloads. The containerized design means it’s easy to ship, deploy, and scale—perfect for teams building hyperscale AI infrastructure fast without compromising on cooling reliability, 42U compatibility, or 50kW thermal performance. Product Family
Product FeaturesAdvanced Cold Plate Cooling for 50kW High-Density RacksDesigned for hyperscale AI workloads, our direct-to-chip cold plate technology efficiently manages 50kW per 42U rack. This system features a secondary loop with precision flow control and leak-safe redundancy, ensuring that high-performance GPUs and accelerators remain at optimal temperatures. By removing heat directly at the source, it eliminates thermal bottlenecks and maximizes the compute density of your containerized infrastructure. In-Row Hyperscale Container Data CenterDesigned for hyperscale AI workloads, our direct-to-chip cold plate technology efficiently manages 50kW per 42U rack. This system features a secondary loop with precision flow control and leak-safe redundancy, ensuring that high-performance GPUs and accelerators remain at optimal temperatures. By removing heat directly at the source, it eliminates thermal bottlenecks and maximizes the compute density of your containerized infrastructure. Full Series OF AI Ready DATA CENTER SOLUTIONSFocus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation. 5-30 kW per Cabinet Cold Aisle Data CenterAirtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads. 10-80 kW Total Power 20ft Container DCPrefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios. 30-100 kW per Cabinet 40ft Cold Plate Container DCHybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption. 50-200 kW per Cabinet 40ft Immersion Container DCImmersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters. APPLICATIONSEmpowering next-generation infrastructure with superior thermal management for high-wattage computing demands. FAQ1. What defines a data center as "AI-Ready"?An AI-Ready data center is engineered for extreme power density and
thermal management. It features reinforced floor loading for heavy
GPU clusters, high-voltage power distribution (such as 415V or
480V) to the rack, and a flexible cooling architecture capable of
supporting 40kW to 100kW+ per cabinet. 2. How does the infrastructure support high-performance networking (RDMA)?Our AI-Ready modules are designed with specialized overhead cable
management systems to handle the high-density fiber counts required
for InfiniBand and RoCE networks. We ensure optimized cable path
lengths to minimize latency and maintain the strict bend radii
necessary for 400G and 800G optical interconnects. 3. Can your AI-Ready racks support liquid cooling for NVIDIA Blackwell or H100 systems?Yes. Our racks are pre-configured for liquid-to-chip cooling. They
feature integrated manifolds and space for Coolant Distribution
Units (CDUs), making them fully compatible with the high thermal
design power (TDP) requirements of the latest NVIDIA Blackwell and
Hopper architectures. 4. How do you handle the massive power surges associated with AI training loads?AI workloads create highly variable power demands. Our solutions
utilize intelligent PDUs and UPS systems with high-discharge
batteries or flywheels that can handle rapid "step-loads," ensuring
electrical stability even when thousands of GPUs ramp up to full
power simultaneously. 5. Are these modules scalable for rapid "Day 2" expansions?Absolutely. We use a modular "building block" design. You can start
with a few high-density AI pods and add more as your compute needs
grow. The cooling and power hookups are standardized for rapid
deployment, reducing the "Ready-for-Service" time by up to 30%
compared to traditional builds. 6. What is the maximum rack weight capacity for fully loaded AI servers?Our AI-specific cabinets are built with heavy-gauge reinforced
steel, supporting a static load rating of up to 2,200kg (approx.
4,850 lbs). This safely accommodates full-stack AI configurations,
including internal bus bars, liquid manifolds, and multi-node GPU
systems. 7. How does AI-readiness impact the sustainability (PUE) of the facility?AI-Ready centers actually improve efficiency by moving cooling
closer to the heat source. By utilizing Rear Door Heat Exchangers
(RDHx) or Direct Liquid Cooling (DLC), we can remove heat more
efficiently than traditional air-only methods, targeting a PUE of 1.12 or lower even at 100kW per rack densities. Have more questions about our Liquid Cooling Solutions?Contact Us Now |
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Cold Plate In Row Hyperscale Container Data Center 42U 50kW |