High Density DTC Cold Aisle Enterprise Data Center Containment Solutions
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The High-Density Cold Aisle Containment Solution is a purpose-built infrastructure designed to support the extreme thermal demands of AI Training Clusters and High-Performance Computing (HPC). Unlike standard IT containment, this "Liquid-Cooling Ready" system supports hybrid cooling architectures, allowing for the seamless integration of Direct-to-Chip (DTC) liquid cooling loops alongside traditional precision air cooling. Engineered for Tier IV mission-critical environments, this solution handles power densities exceeding 15kW to 30kW per rack. It features reinforced structural load-bearing for heavy GPU servers, specialized piping pathways for coolant distribution, and smart environmental monitoring, making it the ideal foundation for next-generation LLM (Large Language Model) training facilities and scientific computing centers. Product Family
Product FeaturesAI-Ready High-Density InfrastructurePowering Next-Gen Compute: Our infrastructure is engineered to handle the extreme thermal demands of Generative AI and Large Language Models (LLMs). By integrating dedicated liquid cooling manifolds and ultra-high-capacity power busbars, the system supports power densities exceeding 100kW per rack, ensuring your facility is ready for the latest GPU architectures. Architectural Adaptability & Hyperscale PowerLimitless Flexibility: Unlike rigid standard modules, we customize aisle width, height,
and length (up to 48 racks) to fit irregular room shapes or
existing support pillars, maximizing whitespace utilization for
dense AI clusters. Full Series OF HIGH-DENSITY DATA CENTER SOLUTIONSFocus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation. 5-30 kW per Cabinet Cold Aisle Data CenterAirtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads. 10-80 kW Total Power 20ft Container DCPrefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios. 30-100 kW per Cabinet 40ft Cold Plate Container DCHybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption. 50-200 kW per Cabinet 40ft Immersion Container DCImmersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters. APPLICATIONSEmpowering next-generation infrastructure with superior thermal management for high-wattage computing demands. FAQ1. What defines a data center as "AI-Ready"?An AI-Ready data center is engineered for extreme power density and
thermal management. It features reinforced floor loading for heavy
GPU clusters, high-voltage power distribution (such as 415V or
480V) to the rack, and a flexible cooling architecture capable of
supporting 40kW to 100kW+ per cabinet. 2. How does the infrastructure support high-performance networking (RDMA)?Our AI-Ready modules are designed with specialized overhead cable
management systems to handle the high-density fiber counts required
for InfiniBand and RoCE networks. We ensure optimized cable path
lengths to minimize latency and maintain the strict bend radii
necessary for 400G and 800G optical interconnects. 3. Can your AI-Ready racks support liquid cooling for NVIDIA Blackwell or H100 systems?Yes. Our racks are pre-configured for liquid-to-chip cooling. They
feature integrated manifolds and space for Coolant Distribution
Units (CDUs), making them fully compatible with the high thermal
design power (TDP) requirements of the latest NVIDIA Blackwell and
Hopper architectures. 4. How do you handle the massive power surges associated with AI training loads?AI workloads create highly variable power demands. Our solutions
utilize intelligent PDUs and UPS systems with high-discharge
batteries or flywheels that can handle rapid "step-loads," ensuring
electrical stability even when thousands of GPUs ramp up to full
power simultaneously. 5. Are these modules scalable for rapid "Day 2" expansions?Absolutely. We use a modular "building block" design. You can start
with a few high-density AI pods and add more as your compute needs
grow. The cooling and power hookups are standardized for rapid
deployment, reducing the "Ready-for-Service" time by up to 30%
compared to traditional builds. 6. What is the maximum rack weight capacity for fully loaded AI servers?Our AI-specific cabinets are built with heavy-gauge reinforced
steel, supporting a static load rating of up to 2,200kg (approx.
4,850 lbs). This safely accommodates full-stack AI configurations,
including internal bus bars, liquid manifolds, and multi-node GPU
systems. 7. How does AI-readiness impact the sustainability (PUE) of the facility?AI-Ready centers actually improve efficiency by moving cooling
closer to the heat source. By utilizing Rear Door Heat Exchangers
(RDHx) or Direct Liquid Cooling (DLC), we can remove heat more
efficiently than traditional air-only methods, targeting a PUE of 1.12 or lower even at 100kW per rack densities. Have more questions about our Liquid Cooling Solutions?Contact Us Now |
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