40ft Immersion Cooling Modular Data Center Container For AI Ready Data Center
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The exponential growth of Large Language Models (LLMs) has pushed chip thermal design power (TDP) beyond the physical limits of air cooling. Hyperscale operators face a "thermal wall" where traditional cooling consumes too much energy and space to support next-generation GPU clusters efficiently, creating an urgent demand for advanced cooling solutions tailored for AI ready data centers. Breaking through this barrier requires a fundamental shift in physics. The 40ft Immersion Cooling Modular Data Center Container For AI Ready Data Center is engineered specifically for the hyperscale era, serving as a megawatt-class infrastructure solution designed to fit within a standard logistics footprint, and it is perfectly optimized to meet the stringent thermal and operational requirements of AI ready data centers. Housing up to 12 high-capacity immersion tanks, this AI-centric modular data center container delivers a massive total capacity of 1.2 MW. It features a fully integrated secondary cooling loop with redundant pump groups and adiabatic dry coolers. By ensuring every transistor stays within its optimal thermal envelope, it unlocks the full potential of high-performance AI chipsets while reducing the facility's carbon footprint by up to 40%, making it a pivotal and sustainable infrastructure choice for building and scaling AI ready data centers. Product Family
Product Features40ft Megawatt-Scale AI DensityThis 40ft modular container supports unprecedented power densities, housing multiple high-capacity immersion tanks to reach megawatt-level compute power. By consolidating massive AI GPU clusters into a single mobile footprint, it drastically reduces land requirements and site preparation time compared to traditional brick-and-mortar data centers. Sustainable Zero-Water OperationThe integrated closed-loop cooling architecture utilizes advanced dry cooler technology, consuming zero water for heat rejection. This makes our 40ft immersion container the ideal ESG-compliant choice for water-scarce regions, while the automated dielectric fluid management system ensures continuous, high-performance operation for AI training without environmental impact. Full Series OF AI Ready DATA CENTER SOLUTIONSFocus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation. 5-30 kW per Cabinet Cold Aisle Data CenterAirtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads. 10-80 kW Total Power 20ft Container DCPrefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios. 30-100 kW per Cabinet 40ft Cold Plate Container DCHybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption. 50-200 kW per Cabinet 40ft Immersion Container DCImmersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters. APPLICATIONSEmpowering next-generation infrastructure with superior thermal management for high-wattage computing demands. FAQ1. What defines a data center as "AI-Ready"?An AI-Ready data center is engineered for extreme power density and
thermal management. It features reinforced floor loading for heavy
GPU clusters, high-voltage power distribution (such as 415V or
480V) to the rack, and a flexible cooling architecture capable of
supporting 40kW to 100kW+ per cabinet. 2. How does the infrastructure support high-performance networking (RDMA)?Our AI-Ready modules are designed with specialized overhead cable
management systems to handle the high-density fiber counts required
for InfiniBand and RoCE networks. We ensure optimized cable path
lengths to minimize latency and maintain the strict bend radii
necessary for 400G and 800G optical interconnects. 3. Can your AI-Ready racks support liquid cooling for NVIDIA Blackwell or H100 systems?Yes. Our racks are pre-configured for liquid-to-chip cooling. They
feature integrated manifolds and space for Coolant Distribution
Units (CDUs), making them fully compatible with the high thermal
design power (TDP) requirements of the latest NVIDIA Blackwell and
Hopper architectures. 4. How do you handle the massive power surges associated with AI training loads?AI workloads create highly variable power demands. Our solutions
utilize intelligent PDUs and UPS systems with high-discharge
batteries or flywheels that can handle rapid "step-loads," ensuring
electrical stability even when thousands of GPUs ramp up to full
power simultaneously. 5. Are these modules scalable for rapid "Day 2" expansions?Absolutely. We use a modular "building block" design. You can start
with a few high-density AI pods and add more as your compute needs
grow. The cooling and power hookups are standardized for rapid
deployment, reducing the "Ready-for-Service" time by up to 30%
compared to traditional builds. 6. What is the maximum rack weight capacity for fully loaded AI servers?Our AI-specific cabinets are built with heavy-gauge reinforced
steel, supporting a static load rating of up to 2,200kg (approx.
4,850 lbs). This safely accommodates full-stack AI configurations,
including internal bus bars, liquid manifolds, and multi-node GPU
systems. 7. How does AI-readiness impact the sustainability (PUE) of the facility?AI-Ready centers actually improve efficiency by moving cooling
closer to the heat source. By utilizing Rear Door Heat Exchangers
(RDHx) or Direct Liquid Cooling (DLC), we can remove heat more
efficiently than traditional air-only methods, targeting a PUE of 1.12 or lower even at 100kW per rack densities. Have more questions about our Liquid Cooling Solutions?Contact Us Now |
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