Equipment Overview The equipment adopts a dual-drive gantry platform and a customized
feeding system. It is compatible with Gel-Pak, Wafer Pak, blister
trays, and special fixtures, making it suitable for micro-assembly
applications in the pump source industry. Highlights - Multi-Component Compatibility: Simultaneously supports the
placement of SAC, PBS, and PBC components.
- High Placement Accuracy: Up to ±20 μm (standard configuration).
- Precision Arrangement: Capable of traying/arranging COS chips and
solder preforms.
- Versatile Shim Handling: Supports the placement of both large and
small shims.
Technical Specifications | Parameter Name | Specification | | Cycle Time | 1.5s (Depends on product) | | XY Placement Accuracy | ±20μm @ 3σ (Standard die accuracy) | | Die Rotation | ±0.5° @ 3σ (Depends on product) | | Die Size | 0.15×0.15mm - 5×5mm (Lens change required based on product) | | Die Thickness | 0.076 - 1mm (3 - 40mil, Standard) Min. 0.05mm (2mil, Optional) | | Lead Frame Size | L: 100-300mm; W: 40-90mm (Customization required for <40mm); H:
0.1-0.8mm (Standard), 0.8 - 2.0mm (Optional) | | Tray Size | (Provided by customer based on product) | | Size Range | 200*250mm | | Alignment Standard | Center clamping, Y-direction edge alignment | | Bonding Force | 20-300g (Customizable) | | Pick-up Method | Blister tray, Metal tray | | PR System | 256 Grayscale | | Resolution | 5472pixel × 3648pixel (Customizable) | | PR Accuracy | FOV (16.4mmX10.9mm) | | Angle Tolerance | ±0.1° | | Dimensions | W: 1240mm; H: 1550mm; D: 1800mm (Subject to final product) | | Weight | 1500KG (Subject to final product) |
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