China Lasers and Welding Machines manufacturer
United Winners Laser Co., Ltd
United for Win-Win, Intelligently Building the Future
2
Home > Products > Semiconductor Packaging and Testing Equipment >

Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors

Multi Head Die Bonder Equipment For Optical Modules / HDMI USB Connectors

Cycle Time 3s-12s (Depending on product)
Placement Accuracy ±3 @3σ (Depending on product)
Angular Accuracy ±0.5° @3σ (Depending on product)
Tray Size Customer Provided
Bonding Force 20-300g (Customizable)
Standard Track Width 40-90mm (Customizable)
Brand Name UW
Certification CE ISO
Minimum Order Quantity 1set
Price Negotiation
Packaging Details carton box/wooden box
Payment Terms T/T
Detailed Product Description

Equipment Overview

This equipment is designed for the high-precision assembly of optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, and driver modules

 

Highlights

  • High precision assembly: SP class silent linear guides with straightness within 2 μm; laser interferometer motion compensation; placement accuracy ±0.8 μm; repeatability ±0.4 μm. Supports fast, high‑precision timing of 6 pulses in 100 ms, ensuring consistent accuracy across production units and minimizing precision degradation from moving components.
  • Reduced misjudgment: Independent micro‑flow air circuits per nozzle enable individual loop detection, lowering system false judgments.
  • Strong compatibility: Simultaneously supports placement of optical chips and electrical chips.
  • Professional support: A dedicated vision team provides customized, efficient, and accurate positioning solutions for various products.
  • Customization: Upgradeable to a eutectic bonder with the addition of a eutectic module.

Specifications

Parameter NameParameter Value
Cycle Time3s-12s (Depending on product)
Placement Accuracy±3 @3σ (Depending on product)
Angular Accuracy±0.5° @3σ (Depending on product)
Die Size0.15×0.15mm - 5×5mm (Lens change required based on product)
Die Thickness0.076 - 1mm (3 - 40mil, Standard). Min. 0.05mm (2mil, Optional)
Lead Frame SizeL: 100 - 300mm; W: 40 - 90mm (Customization required for <40mm). H: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional)
Tray SizeCustomer Provided
Wafer SizeCompatible with 6-8 inch wafers (2-inch, 4-inch waffle packs)
Auto θ Calibration±15° Range
Max Wafer Angular Correction360°
Bonding Force20-300g (Customizable)
Standard Track Width40-90mm (Customizable)
PR System256 Grayscale / Edge Detection
Resolution1920pixel×2560pixel (Customizable)
PR Accuracy5M (1920×2560pixel) FOV (16mm;×1,×2,×4)
Angular Tolerance±0.1
DimensionsW: 1630mm; H: 1160mm; D: 1500mm (Subject to final product)
Weight1200KG (Subject to final product)

 

Product Tags: Multi Head Die Bonder Equipment   Optical Modules Die Bonder Equipment  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: United Winners Laser Co., Ltd
Subject:
Message:
Characters Remaining: (80/3000)