Nitrogen Reflow Soldering Equipment 50mm-400mm SMT Reflow Soldering Machine

SER Series Nitrogen Reflow Soldering Ovens Hot air SMT Assembly

    Reflow soldering equipment is used to heat the PCB after component placement at high temperatures, melting the solder paste on both sides of the component and bonding it to the circuit board, thus completing the soldering process. The application scope of reflow soldering is very wide, covering almost all production and manufacturing fields of electronic products, such as consumer electronics, lighting, automotive electronics, communication equipment, industrial control, aerospace, energy industry, etc.

Features:

• High heat energy: professional heat energy supply theoretical basis, through matching the appropriate heating power and volume to ensure large heat energy supply. Sufficient thermal energy to generate optimal thermal efficiency, maximize the productivity in short heating zones.
• Low energy consumption: theoretical design and practical testing, through customer verification, obtain the best repeatability results CPK value, get the lowest energy consumption in the factory site.
• Thermal equalization: theoretical and practical verification, ensure to achieve the minimum heat absorption difference between small and large components with the same speed, the same temperature setting, achieve the best equilibrium.
• Large size: can handle larger size PCB in the same size machine; double tracks machine can produce PCB with 300 mm in width a t the same time, and PCB with 550mm in width with single track setting, which can meet the demand of many customers.

Product Parameters:

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m².

3.External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.