Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

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Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+86--13714780575

Contact Person:
Ms.Yang View Contact Details

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Brand Name	Suneast
Model Number	SEMI-08N｜SEMI-10N｜SEMI-13N
Certification	CE、ISO
Place of Origin	Shenzhen, Guangdong Province, China
Minimum Order Quantity	≥1 pc
Price	Negotiable
Payment Terms	T/T
Delivery Time	25~50 days
Packaging Details	Plywood crate
Name	Reflow Soldering Oven
Model	SEMI-08N
Dimension	5680(L)1710(W)1650(H)mm
Weight	2400-2600kg
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW
Normal consumption	10KW
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Power Outage Protection	Equipped with UPS
N2 area	Full nitrogen filling

Detailed Product Description

SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System

Application:

The solder paste which is printed on the convex metal surface will be refluxed into a ball to complete the combination welding of the tin ball and the substrate
After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing

Core Technology:

01 Hot air system with patent, efficient heat compensation ability, accurate temperature control accuracy

02 With nitrogen protection in the whole process, independent nitrogen control in each temperature zone, to prevent components oxidation during the welding process

03 Low oxygen content control in the furnace which will be within 50-200PPM during the whole process, to ensure good welding quality

04 Modular design, efficient cooling system, cooling slope can reach 0.5-6℃/S, to meet the requirements of each process cooling slope

05 Fine mesh belt for smooth conveying, also for tiny components transmission, prevent falling, to ensure stable product quality

06 Efficient and clean treatment, to meet the requirements of dust-free workshop for semiconductor

Product Features:

CONVEYOR SYSTEM Special fine mesh belt transmission for semiconductor, for tiny components, to prevent falling and jamming
HOT AIR SYSTEM MULTI-FREQUENCY CONTROL Multi-frequency converter control, more precise temperature control, the air flow range can be controlled from low to high, to ensure that the control system is stable and reliable
ROSIN RECOVERY SYSTEM There’re independent rosin recovery devices at the inlet and outlet sides, and also for the preheating area, multistage filtration
FULL NITROGEN PROTECTION SYSTEM, LOW OXYGEN CONTENT The nitrogen is charging in the whole process and controlled Independently in each process section; ultra-low oxygen concentration environment, and the oxygen content in the furnace can be within 50PPM to ensure excellent welding quality
LOW NITROGEN CONSUMPTION Brand new furnace structure design, multi-layer heat insulation, closed-loop control of recovery system, effectively save the amount of nitrogen and save the use cost
EFFICIENT HOT AIR CIRCULATION HEATING SYSTEM Multi-layer heat insulation design, high stability of thermal efficiency, low energy consumption, reduce production costs
COOLING SYSTEM Cooling zone with high power cold water system to ensure optimal cooling slope
CONTROL SYSTEM Super temperature control ability, to meet the packaging heating process profile of semiconductor
HIGH CLEANLINESS Special clean room for R&D, thousand level of cleanliness, to meet the requirements of high cleanliness environment of semiconductor equipment
CONVEYOR SYSTEM The software supports SECS/GEM semiconductor communication protocol, connects the intelligent factory information and control system, which can effectively realizes the functions of connection management, data collection, alarm, control status, equipment terminal service and message log, etc

Product Parameters:

Model No	SEMI-08N	SEMI-10N	SEMI-13N
Heating system
Heating zone structure	8 heating zones, 16 heating modules	10 heating zones, 20 heating modules	13 heating zones, 26 heating modules
Heating zone length	2950mm	3670mm	4750mm
Heating up time	20min	25min	25min
Outlet Exhaust Diameter,valume	2-Ø145,Exhaust demand 10m³/min x2
Cooling system
Cooling type	Three cooling zones:forced water cooling
Cooling zone length	1250mm
Chiller power	External Water chiller (Optional: connected to customer workshop cooling water)
Conveyor system
Conveyor Type	Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt)
Conveyor Direction	L→R,R→L
Conveyor Height	900±20mm
Mesh belt width	24" (Other width sizes can be customized.)
Component Height	20mm
Conveyor Speed	300mm-2000mm/min
Control system
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW	89KW	118KW
Startup Power	35KW	38KW	42KW
Normal consumption	10KW	12KW	14KW
Temp Control Range	Room temperature to 320℃
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Data Storage	Process Data and status stotage
Power Outage Protection	Equipped with UPS
Operation Interface	Windows Chinese simplified, English online free switching
N2 area	Full nitrogen filling
Secs/Gemcommunication protocol	Standard
MES communication protocol	Standard
Computer	Commercial computer
Machine Parameter
Dimension(LxWxH)	5680x1710x1650mm	640017101650mm	750017101650mm
Weight	2400-2600kg	3200-3400kg	3600-3800kg
Flux recovery system	Standard
Color	Bright wrinkled white

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m²

3.External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

Product Tags: combined multi module selective wave solderings wave soldering combined multi module selective multi module selective wave soldering combined

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