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fr4 tg150 high density pcb design
Selling leads
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Product Description Layer Count:4 Material:FR4 TG150 Thickness:1.6mm Min.Hole Size:0.4mm,unaccept solder mask in vias Copper Thickness:Inner 1oz/Outer ...
2025-07-23 00:25:36
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Product Description HDI Layer Count:6 Material:FR-4, TG150 Thickness:0.55mm Finish Copper:1/H/H/H/H/1 oz Surface Finish:ENIG TECircuit Capability 1. ...
2025-07-23 00:25:36
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Product Description Layer Count:6L 1Step HDI Material:FR-4,TG150,S1150G Thickness:0.8mm Min.Hole Size:0.1mm Dimension:92.79* 132.6 Surface Finish...
2025-07-23 00:25:36
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