RIGID HDI Printed Circuit Board 6 Layers FR4 TG150 OEM PCB Design Manufacturing

TECircuit Capability

1. Schematic development and PCB layout(what we use is Protel, PADS)
2. PCB fabrication from 1-40 layers. (single side, double side, multi-layer, HDI board, bury and blind holes board etc)
3. Material procurement and management
4. Prototype and NPI (new product introduction)
5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through hole assembly, in-circuit test and functional testing)
6. IC pre-programming and Function verification & burning test
7. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
8. Environmental Coating
9. Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure and pac

Product Inspection Services

1.QC checklistconsultation and development.
2.Sample review by qualified engineers.
3.Personalized quoting of inspection tests,procedures and sample size tailored to fit your needs and budget.
4.Bilingual,western staffdedicated to guiding you through the product inspection process,answering any questions and serving as your lifeline on the ground in Asia.
5.IQC, during production inspections,final pre-shipment inspections and container loading monitoring carried out by qualified auditors experienced with your product type.
6.Inspection reports issues same-day at no additional cost.