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communication circuit board assembly
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Product Description HDI Layer Count:6 Material:FR-4, TG150 Thickness:0.55mm Finish Copper:1/H/H/H/H/1 oz Surface Finish:ENIG TECircuit Capability 1. ...
2025-07-25 00:27:50
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Product Description Layer Count:2 Material:FR4 + PI Surface Finish:Immersion Gold 2u” Special Feature:Rigid + Flex Product images TECircuit Capability ...
2025-07-25 00:27:50
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Product Description Layer 4L Material Rigid-flex MIXED Board Thickness 1.2 MM Copper Thickness Inner 1oz /Outer 1 oz Surface treatment Immersion Gold ...
2025-07-25 00:27:50
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Product Description Layer 2L Material FPC R-F775 Board Thickness 0.15MM Copper Thickness 1/1 oz Surface treatment Immersion Gold 2U" Special ...
2025-07-25 00:27:50
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Product Description Rigid-flex board Layer Count:2 Material:FR-4 Surface Finish:ENIG .detail_module_4 .graphic { max-width: 1160px; margin: 0 auto; } ...
2025-07-25 00:27:50
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Product Description Layer 6L Material FR4 Board Thickness 1.6 MM Copper thickness Inner 1oz /Outer 1 oz Dimension 132.5 * 314.4 MM /4ups Surface ...
2025-07-25 00:27:50
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Product Description Layer 2L Material FR4 Board Thickness 1.6 MM Copper Thickness 1oz Surface treatment Immersion Gold 2U"+Carbon ink Special ...
2025-07-25 00:27:50
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Product Description Coil PCB Layer Count:2 Material:FR-4,TG135 Thickness:0.8mm Finish Copper inner/outer:43/43um Hole Size:>=0.25mm Surface Finish...
2025-07-25 00:27:50
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Product Description Application:automotive Layer Count:2 Material:FR-4,TG150 Thickness:1.0mm Dimension:202*91.5 Surface Finish:ENIG Laser DMC Code ...
2025-07-25 00:27:50
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Product Description Layer Count:4 Material:FR-4,TG150 Thickness:1.6mm Finish Copper inner/outer:1/1/1/1 oz Min.Hole Size:0.4mm Dimension:182.5*135 ...
2025-07-25 00:27:50
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