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semiconductor die bonder machine
Selling leads
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... for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, ...
2026-04-20 00:40:31
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... station for improved operator efficiency and production cycle time Internationally leading dual die bonding, dual dispensing, and dual wafer ...
2026-04-20 00:40:31
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..., compatible with a docking station, facilitate operator operation and connection, improving production cycle time; ● Utilizes internationally ...
2026-04-20 00:40:31
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...pick and place machine Features: High PCB handling capacity in a medium speed bonder 510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1...
2026-04-20 00:40:31
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... High speed laminating machine without conductor and double suction bar can perfectly solve the problem that multiple materials can be taken twice ...
2026-04-20 00:40:31
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Dimensions (L*W*H) 2200(L)x1340(W)x1480(H)mm Power supply AC:220± 10%,50/60H乙2.5KW PCB Max Size (L)x(W) 1200X400mm Number of storage boxes 1 PCS PCB ...
2025-12-25 16:33:22
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