Samsung Decan S1 SMT Equipment 0.05mm Ultra-Fine Pitch Auto Feeder
& Vision System PCB Board Assembly Pick and Place Chip Mounter
For SMT Assembling Line Production
Product description
DECAN S1 pick and place machine Features:
High PCB handling capacity in a medium speed bonder
510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L)
x 460mm(W) size can be produced
High Reliability
Stable mounting of microchips
Automatic calibration is performed during production to maintain
consistent placement accuracy
Productivity
Best performance in its class
Expanding the range of component recognition by camera high
pixelation, increasing the simultaneous pick-up rate and speed of
shaped component placement
Easy Operation
Enhanced ease of use
Easy and shortened calibration time for large odd-shaped components
Maintains Chip component lighting level unification function and
common feeder pickup coordinates
Product specification
| Model Name | DECANS1 |
| Alignment |
|
| Fly Camera + Fix Camera |
| The number of spindles |
|
| 10 spindles x 1 Gantry |
| Placement Speed |
|
| 47,000 CPH (optimum) |
| PlacementAccuracy | Chip |
| +28um @ Cpk≥ 1.0 |
| IC |
| t35um @ Cpk≥ 1.0 |
| ComponentRange | Fly Camera |
| 03015~ □16mm |
| Fix Camera |
| ~42mm (Standard)
□42mm~ □55mm(MFOV)
L55mm~ L75mm Connector (MFOV) |
| Max. Height |
| 10mm (Fly), 15mm (Fix) |
| PCB size(mm) | Min. |
| 50[L) x40(W) |
| Max. | Standard | 510(L)x 510(W) |
| Option | ~ Max. 1,500(L) x 460(W) |
| PCB Thickness (mm) |
|
| 0.38~4.2 |
Feeder Capacity
(8mm standard) |
| Standard | 60ea / 56ea (fixed feederbase / Docking Cart) |
| Option | 120ea/ 112ea (Fixed feederbase / Docking Cart) |
| Utility |
| Power | 3Phase Ac200/208/220/240/380/415V |
| Max. 3 5kVA |
| Air Consumption | 5.0~7.0kgf/cm? |
|
| 50Ne/min (Vacuum Pump) |
| Weight (kg) |
|
| Approx. 1.600 |
| External Dimension (mm) |
|
| 1,430(L)x 1,740(W)x 1,485(H) |
Product details
Applications:
Widely used in electronics manufacturing, consumer electronics,
automobile electronics, communications equipment, aerospace,
medical equipment, LED lamps, computers and peripherals, smart
home, smart logistics, miniature and high power ratio electronic
devices.
