Automatic SMT Online Solder Paste Inspection Machine Sinicktek 3D SPI S8080 For PCB Assembling SMD Soldering Testing Manufacturing Line

Product Specification

Core Technology and features

Principle of programmable structure grating PMP imaging technology

The phase modulation profilometry (PMP) is used to realize the 3D measurement 

of the solder paste in precision printing.

RGB Tune active tricolor, 2D lighting source

The patented RGB Tune feature solves the problems of bridge miscalculation and relative datum uncertainty by taking red-green-blue primary color photos alone and combining with a unique color filtering algorithm, and provides 2D/3D measurements at the same time, results the RGB color distortion caused by the red light angle of the paste can be effectively avoided by using the color solder paste picture and 2d light source The RGB debugging versatility of different substrate colors greatly improves the repeatability accuracy of the equipment (height, volume, area) .

High-precision integrated control platform

High-strength steel structure, standard servo motor with high-precision grinding ball screw, and guide rail, high-speed, smooth movement. The selected linear motor and high-precision grating ruler can be used to measure the solder paste of 03015 element with super-precision and high-speed, and the repeatability precision can reach 1um.

Three-point photo function

Cooperate with different testing equipment on SMT production line, such as Aoi in front and Aoi in back, to form a closed loop, quality control system, and can synchronize data to quality control system, such as ERP.

MES intelligent manufacturing access capability

SINICTEK developed a variety of data format ports, through the SPI system can be simple, fast, accurate data transfer to the client of the MES system.

Five-minute programming and one-click operation

By importing the Gerber module and friendly programming interface, engineers of all levels can program independently, quickly and accurately. The one-button operation designed for operators also greatly reduces the pressure of training.

Application of 3D SPI in the field of ultra-dense solder paste

Miniled, MicroLED by a small LED lamp, the number of small leds on a single board can reach more than 1 million pads, MiniLED's single unit size is about 100-200 μm, and MicroLED's single unit size can be in 50 μm; Therefore, the 3DSPI equipment used in the ultra-dense products are used in the industry's highest configuration, especially the marble platform, linear motor and grating ruler to ensure the movement of small-size pad precision. By using the leading telecentric lens with 1.8 μm resolution and optimizing the Gerber transform, Load Job, algorithm, data saving and query, the accuracy, speed and efficiency of detection are greatly improved.

Applications:

Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.