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Automatic 3D SPI Machine Sinictek S2020 Online optical inspection equipment

Automatic 3D SPI Machine Sinictek S2020 Online optical inspection equipment

Brand Name Sinictek
Model Number S2020
Certification CE
Place of Origin China
Minimum Order Quantity 1
Price 15000 ( For reference)
Payment Terms T/T
Supply Ability The production capacity is 200 units a month
Delivery Time 5-15
Packaging Details Vacuum packing plus wooden box packing
Name SMT automatic solder paste inspection machine
Supplier HXT
Model number S2020/S8080/S8030
Product name smt 3D SPI
Maximum board size 450x450mm
Usage SMD LED SMT
Core components PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump
Application SMT PCB Assembly Production Line
Condition Original new and used
Detailed Product Description

High Precision Sinicktek 3D SPI S2020 Automatic Solder Paste Inspection Machine With High Speed Testing Inline optical inspection equipment PCB Assembling Manufacturing Line



Product Specification


Parameters
Technology PlatformType-B/C Single Rail
SeriesSHero/Ultra
ModelS8080 /S2020/Hero/Ultra
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry)
Measurementsvolume,acreage,height, XY offset, shape
Detection of Non-Performing Typesmissing print,insufficienttin, excessive tin, bridging, offset, mal-shapes, surface contamination
Lens Resolution4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um(Optional for different camera models)
AccuracyXY (Resolution):10um
Repeatabilityheight:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma);
Gage R&R<<10%
Inspection Speed0.35 sec/FOV -0.5 sec/FOV (depending on the actual configuration)
Quanlity of Inspection HeadStandard 1, matching 2,3
Mark-point Detection Time    0.3sec/piece
Maximun Meauring Head±550um (±1200um as option)
Maximun Measuring Height of PCB Warp          ±5mm
Minimun Pad Spacing100um -LRB-base pad height of 150um) 80um/100um/150um/200um (depending on the actual configuration)
Minimum element01005/03015/008004(Optional)
Maximun Loading PCB Size(X*Y)450x450mm(B)Large platform with 630x550mm (InSPIre 630)
Conveyor Setupfront orbit (back orbit as option)
PCB Transfer DirectionLeft to right or Right to left
Conveyor Width Adjustment      manual & automatic
SPC/Engineering StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import    support Gerber format(274x,274d),manual Teach model);CAD X/Y,Part No.,Package Type imput)
Operating System SupportWindows 10 Professional (64 bit)
Equipment Diemension and WeightW1000xD1150xH1530(B),965Kg  W1000xD1174xH1550(C),985Kg
OptionalOne person controls more machines,NetworkSPC(Software only ), 1D / 2D Barcode scanner, out-line programming software, UPS continuous power supply


Core Technology and features

Principle of programmable structure grating PMP imaging technology

 

The phase modulation profilometry (PMP) is used to realize the 3D measurement 

of the solder paste in precision printing.


RGB Tune active tricolor, 2D lighting source

The patented RGB Tune feature solves the problems of bridge miscalculation and relative datum uncertainty by taking red-green-blue primary color photos alone and combining with a unique color filtering algorithm, and provides 2D/3D measurements at the same time, results the RGB color distortion caused by the red light angle of the paste can be effectively avoided by using the color solder paste picture and 2d light source The RGB debugging versatility of different substrate colors greatly improves the repeatability accuracy of the equipment (height, volume, area) .


High resolution image processing system

Provide 2.8 μm, 4.5 ΜM, 5 μm, 7 ΜM, 8 μm, 10 ΜM, 12 ΜM, 15 ΜM, 18 ΜM, 20 μm and many other different detection accuracy. Comply with customer requirements for product diversity and testing speed.


Z-axis dynamic compensation + telecentric lens static compensation

Using high-cost telecentric lens and special software testing algorithm, the problem of strabismus and distortion of ordinary lens is solved, and the detection accuracy and ability are greatly enhanced. Achieved the industry-leading, dynamic compensation + static compensation FPC warpage.


High-precision integrated control platform

High-strength steel structure, standard servo motor with high-precision grinding ball screw, and guide rail, high-speed, smooth movement. The selected linear motor and high-precision grating ruler can be used to measure the solder paste of 03015 element with super-precision and high-speed, and the repeatability precision can reach 1um.


Mark Point Recognition, bad board flight recognition, closed-loop control

Automatically identify Mark points and bad board marks, share real-time detection data to the printer, SMT machine, and real-time, adjust the printing and SMT process.


Three-point photo function

Cooperate with different testing equipment on SMT production line, such as Aoi in front and Aoi in back, to form a closed loop, quality control system, and can synchronize data to quality control system, such as ERP.


MES intelligent manufacturing access capability

SINICTEK developed a variety of data format ports, through the SPI system can be simple, fast, accurate data transfer to the client of the MES system.


Five-minute programming and one-click operation

By importing the Gerber module and friendly programming interface, engineers of all levels can program independently, quickly and accurately. The one-button operation designed for operators also greatly reduces the pressure of training.


Powerful process analysis (SPC)

Real-time SPC information display, provide users with strong quality control support. Full range of SPC tools, so that users at a glance. And support different formats of data output.


Application of 3D SPI in the field of ultra-dense solder paste

Miniled, MicroLED by a small LED lamp, the number of small leds on a single board can reach more than 1 million pads, MiniLED's single unit size is about 100-200 μm, and MicroLED's single unit size can be in 50 μm; Therefore, the 3DSPI equipment used in the ultra-dense products are used in the industry's highest configuration, especially the marble platform, linear motor and grating ruler to ensure the movement of small-size pad precision. By using the leading telecentric lens with 1.8 μm resolution and optimizing the Gerber transform, Load Job, algorithm, data saving and query, the accuracy, speed and efficiency of detection are greatly improved.

Application of 3D SMT SPI in the field of oversize plate

The SMT high quality testing requirements of the super-large board for automobile electronics and LED large screen can not meet the actual production requirements by manual testing, the application of the smart super-large board machine of Stecker solves the on-line SMT of the 1200-2000MM super-large board, detection, to achieve efficient, fast and stable detection.


Applications:


Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.

 

Product Tags: Advanced Solder Paste Inspection Machine   High Speed Solder Paste Inspection Machine   Advanced smt inspection machine  
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