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Rogers RO3006 High Frequency PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao
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Rogers RO3006 High Frequency PCB

Brand Name Bicheng Technologies Limited
Model Number BIC-99xx-V1.39
Certification UL
Place of Origin China
Minimum Order Quantity 1
Price USD 2.88-6.99 per piece
Payment Terms T/T, Paypal
Supply Ability 45000 pieces per month
Delivery Time 4-5 working days
Packaging Details Vacuum
Number of Layers 2 Layer, Multilayer, Hybrid PCB
Glass Epoxy RO3006
Final height of PCB 10mil (0.254mm), 25mil (0.635mm) 50mil (1.27mm)
Final foil external 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish Bare copper, HASL, ENIG, OSP etc..
Solder Mask Color Green, Black, Blue, Yellow, Red etc.
Colour of Component Legend Green, Black, Blue, Yellow, Red etc.
Test 100% Electrical Test prior shipment
Detailed Product Description

Hello everyone,

Today we’re talk about RO3006 high frequency PCBs.

 

RO3006 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

 

More features and applications are as follows:

Firstly, excellent mechanical properties versus temperature, it’s reliable for stripline and multi-layer board constructions.

Secondly, uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

Thirdly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

PCB Capability
PCB Material:Ceramic-filled PTFE composite
Designation:RO3006
Dielectric constant:6.15 ±0.3 (process)
6.5 (design)
Layer count:2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 25mil (0.635mm)
50mil (1.27mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  

 

RO3006 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

 

The basic colour of RO3006 PCB is white.

 

The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

 

Thank you for your reading.

 

Appendix: RO3006 Typical Value

PropertyRO3006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign6.5Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.002Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-262Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.27
0.15
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105 COND AIPC 2.5.17.1
Tensile Modulus1498
1293
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.02 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.86 j/g/k Calculated
Thermal Conductivity0.79 W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 ℃ TGA ASTM D 3850
Density2.6 gm/cm323℃ASTM D 792
Copper Peel Stength7.1 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    

 

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