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STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

Brand Name JIMA
Model Number EDCUSTD
Certification SGS, ISO,Reach, RoHS
Place of Origin china
Minimum Order Quantity 100kg
Price usd 15-20 kg
Supply Ability 1000 Ton per month
Delivery Time 5-15 days
Packaging Details wooden carton
Purity 99.8%
pinholes None
Anti oxidation 200 degree 60 minutes, 180 days 23 degree
Thickness 1/2 oz,3/4 oz,1 oz,2 oz,3 oz,
Color red or gray
Elongation ≥ 2%
tensile strength ≥ 150 MPa
peel strength ≥ 1 N/mm
Detailed Product Description

STD electrodeposited electrolytic ED copper foil (Standard electrodeposited electrolytic ED copper foil )

 

Features:

1.the treated foil in gray or red

1.High peel strength

3.Good etch ability

4.Excellent adhesion to etching resist

Application:

1. Phenolic resin board

2. Epoxy board

3. shielding

 

Typical properties of Standard copper foil for phenolic resin board and epoxy board.

 

Classification

 

UnitRequirementTest Method
Foil Designation/THM123IPC-4562A
Nominal thickness/12um1/2 OZ3/4 OZ

1

OZ

2

OZ

3

OZ

IPC-4562A
Area Weightg/㎡107±4153±5228±8285±10580±15860±20

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤6≤8≤10≤10≤15≤20
Tensile Strength

R.T.(23℃)

 

Mpa≥150≥220≥235≥280≥280≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)

 

≥2≥3≥3≥4≥4≥4

IPC-TM-650

2.3.18

SubjectΩ.g/㎡≤0.170≤0.166≤0.162≤0.162≤0.162≤0.162

IPC-TM-650

2.5.14

Peel Strength(FR-4)N/mm≥1.0≥1.3≥1.6≥1.6≥2.1≥2.1

IPC-TM-650

2.4.8

Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180/
H.T.(200℃)Minutes60/

1. Standard Width,1295(±1)mm,May according to the customer request tailor.

2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

Product Tags: copper foil shielding   copper shielding tape  
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