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fcbga packaging analysis equipment
Selling leads
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... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor ...
2026-04-29 00:08:48
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...Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves ...
2026-04-29 00:08:48
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Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection for Precision Castings porosity Analysis Product Description: ...
2026-04-29 00:08:48
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Unicomp UNCT3200 High-Resolution 450KV 3D CT/computed tomography System for engine blades Castings porosity analysis Product Description: The UNCT3200 ...
2026-04-29 00:08:48
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...Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal castings hardware products plastic products refractory materials ...
2026-04-29 00:08:48
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... mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power ...
2026-04-29 00:08:48
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... tray , Tube package Main Configuration of Chip Counter 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System ...
2026-04-29 00:08:48
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Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, ...
2026-04-29 00:08:48
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X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D ...
2026-04-29 00:08:48
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...equipment adopts the vertical structure of double columns and high-precision monolithic marble base, and is equipped with High power split ray tube ...
2026-04-29 00:08:48
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