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Selling leads
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...Wire Triple-Station Single-Wire Cutting Machine Equipment Introduction Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire ...
2026-04-20 00:09:41
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...precision processing equipment for hard and brittle materials, utilizing diamond-impregnated wire (diamond wire) as the cutting medium to achieve ...
2026-04-20 00:09:41
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... carbide (SiC) ingot, mainly used to divide large size silicon carbide ingot into smaller chunks or segments for subsequent processing. Silicon ...
2025-12-19 16:48:56
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Marble Multi-Wire Cutting Machine Brief Marble Multi-Wire Cutting Machine Diamond Wire for High-Precision Slicing The multi-wire cutting machine ...
2025-12-19 16:48:58
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Multi-wire Cutting Machine Primary Introduction High-Precision Multi-Wire Cutting Equipment for Mass Production of Sapphire Materials The multi...
2025-12-19 16:49:05
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...SAW Devices The 6-inch quartz wafer (150mm diameter) is fabricated from high-purity quartz glass (purity ≥99.999%) with thickness ranging from 50...
2025-07-04 17:08:41
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Monocrystalline Silicon Double Station Square Machine 6/8/12 Inch Burr ≤0.5mm High Precision ±0.05mm
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Abstract Monocrystalline silicon double station square machine 6/8/12 inch burr ≤0.5mm high precision ±0.05mm In the field of semiconductor materials ...
2025-12-19 16:49:02
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Introduction of SiC ingot growing furnace The SiC ingot growing furnace uses PVT, Lely, TSSG and LPE methods to grow large size crystals of 4 inch, 6 ...
2025-12-19 16:49:07
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... of 60mm in diameter and 3mm in thickness. It achieves high-precision dimensional control through directional cutting techniques (e.g., laser ...
2025-08-05 00:14:05
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... is a piezoelectric crystal such quartz (SiO2), lithium tantalate (LiTaO3) or lithium niobate (LiNbO3). This are single crystal materials, which ...
2025-06-18 18:24:45
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