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semiconductor processing ceramic substrate
Selling leads
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Product Description Sapphire ky crystallization furnace kyropoulos foam process growth sapphire crystal 200kg 400kg Kyropoulos bubble method (Ky ...
2025-06-18 18:29:32
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Product Description High-precision laser drilling machine with high efficiency micro-hole processing wavelength 1064nm · Laser source: The core ...
2026-02-10 10:36:27
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.../Multiple Wire Saw Machine For Semiconductor Wafer Processing The diamond wire single/multi-wire dual-station cutting machine is a high-end ...
2026-04-20 00:09:41
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silicon carbide sic broken block,Gem grade sic ingot , 5-15mm thickness sic scrap SiC Wafer Feature Property 4H-SiC, Single Crystal 6H-SiC, Single ...
2025-06-18 18:22:36
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... the stringent demands of modern semiconductor manufacturing and vacuum process environments. Leveraging exceptional thermal stability and chemical ...
2025-12-19 16:49:09
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...Ceramics The diamond wire triple-station single-wire cutting machine is a multi-station collaborative processing system designed for high...
2026-04-20 00:09:41
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...precision processing equipment for hard and brittle materials, utilizing diamond-impregnated wire (diamond wire) as the cutting medium to achieve ...
2026-04-20 00:09:41
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...Semiconductor, and High-Temperature Applications Product Overview Sapphire square raw wafer blanks are semi-finished single-crystal sapphire plates ...
2026-04-20 00:09:41
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Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine equipment introduction Diamond Wire Multi-Wire High-Speed ...
2026-04-20 00:09:41
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...ceramic structural component manufactured using reaction-bonded silicon carbide (RBSiC) process. It is primarily designed for carrying and ...
2025-10-29 12:53:17
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