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semiconductor optical component polishing equipment
Selling leads
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12-Inch High-Speed Diamond Wire Cutting Machine for Sapphire, SiC, Ceramics, and More Product Overview: The Machine is a high-speed, high-precision ...
2026-02-10 10:36:49
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Dual Workstation Swing-Up Multi-Wire Cutting Machine for Hard & Brittle Materials Product Overview: This advanced multi-wire cutting machine is ...
2026-02-10 10:36:50
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... wafer, single side polished silicon wafer 1. Description Density 2.4(g/cm3) Dope type no dope doped B doped P Type I P N resistivity Ø 1000Ωcm ...
2025-06-18 18:27:24
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...semiconductor, optoelectronic, and optical applications. These substrates are polished on a single side for excellent surface smoothness (Ra ≤ 0.2 ...
2026-03-26 19:21:08
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... optical components manufactured from high-purity fused silica (SiO₂ ≥99.999%) using advanced laser drilling, grinding, and polishing techniques. ...
2025-07-04 17:08:45
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... Square Plate is a precision optical component manufactured from high-purity single-crystal aluminum oxide (Al₂O₃) through directional cutting and ...
2026-04-20 00:09:41
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LNP6118 Description: 40 GHz Multi-Band Lithium Niobate Phase Modulator LNP6118 1310 nm-1550 nm The LNP6118 is a broadband LiNbO3 z-cut phase modulator ...
2025-06-18 18:29:28
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... thick glass lens for covering,sapphire optical windows,4inch 0.3mm thickness sapphire wafer, diameter300mm 12inch double side polished sapphire ...
2026-04-20 00:09:41
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End-Pumped laser marking machine of device introduction End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength An end...
2026-04-20 00:09:41
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... (SiO₂) through high-temperature melting processes. Renowned for their exceptional thermal resistance, chemical stability, and optical transparency...
2025-07-04 17:08:47
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