Co Pa 29mm Width Hot Melt Adhesive Tape Polyamide For Sim Card

CO-PA Hot Melt Film 29MM Width Polyamide Hot Melt Adhesive Tape for SIM Card

Hot Melt Adhesive Tape

The hot melt adhesive tape is utilized for embedding contact smart cards. The hot melt adhesive tape exhibits excellent adhesion to PVC, FR-4, and various other materials. This particular product falls under the category of hot-melt tape with low and medium temperature properties. The hot melt adhesive tape possesses high cohesion and favorable flexibility, ensuring that no structural fractures occur during thrust and bending tests after bonding. Additionally, The hot melt adhesive tape maintains a well-balanced bond strength with the chip and card base while exhibiting excellent punchability. The hot melt adhesive tape meets the requirements of ISO7816 standard for chip package durability.

The Characteristics of Hot Melt Adhesive Tape

1.Strong adhesion: hot melt adhesive tape effectively bonds to various materials, including plastics, metals, and textiles.

2.Excellent temperature resistance: hot melt adhesive tape exhibits high temperature resistance, maintaining stable adhesive properties even in high-temperature environments.

3.Superior flexibility: hot melt adhesive tape demonstrates good flexibility, allowing it to adapt to different shapes and curved surfaces for bonding requirements.

4.Chemical resistance: hot melt adhesive tape withstands the corrosion of many chemicals, exhibiting good resistance to corrosion.

5.High production efficiency: hot melt adhesive tape has a fast melting and curing speed, enhancing production efficiency and reducing manufacturing costs.

The Physical Characteristics of Hot Melt Adhesive Tape

Physical Characteristics 

Recommended Bonding Conditions